Matt Barrios, Ph.D.

Professor of Practice

(504) 862-8268
Office Address
225 Stanley Thomas Hall
School of Science & Engineering
Matt Barrios

Courses Taught

ENGP 2011: Electric Circuits Lab

ENGP 3430: Professional Development for Engineers I

ENGP 4310: Team Design Projects and Professional Practice I

Education & Affiliations

Ph.D., Florida State University (2011)

Biography

Dr. Barrios' research interests include Cryogenic Engineering.

Recent Publications

M. Barrios and J. Kynoch, “Helium Recovery at the National High Magnetic Field Laboratory,” IOP Conference Series: Materials Science and Engineering Journal, Volume 101, conference 1, (Proceedings of the Cryogenic Engineering Conference, Tucson, AZ), 2015

V. Ganni, M. Barrios, et al, “FRIB Cryogenic Distribution System,” AIP Conf. Proc. 1573, 880 (2014)

M. Barrios, S.W. Van Sciver, “Thermal Conductivity of Rigid Foam Insulations for Aerospace Vehicles,” Cryogenics, May 2013

M. Vanderlaan, M. Seshadhri, M. Barrios, et al, “MRI of Adsorbed Water in Solid Foams at 21.1 T,” International Journal of Mass and Heat Transfer, 55, 2012

Y. Xu, M. Barrios, et al, “Integrated Thermal Analysis of the FRIB Cryomodule Design,” Proceedings of IPAC 2012

M. Barrios, M. Vanderlaan, and S.W. Van Sciver, “Thermal Conductivity of Spray-On Foam Insulations for Aerospace Applications,” Advances in Cryogenic Engineering (Proceedings of the CEC, Spokane, WA, 2011)

M. Barrios and S.W. Van Sciver, “An Apparatus to Measure Thermal Conductivity of Spray-On Foam Insulation,” Advances in Cryogenic Engineering (Proceedings of the Cryogenic Engineering Conference [CEC], Tucson, AZ, 2009) 55B, 2010, pp. 938-945

M.N. Barrios, Y.S. Choi, H.M. Chang, and S.W. Van Sciver, “Thermal Conductivity of Powder Insulations Below 180 K,” Advances in Cryogenic Engineering (Proceedings of the CEC, Chattanooga, TN, 2007) 53A, 2008, pp. 788-795

Y.S. Choi, M.N. Barrios, H.M. Chang, and S.W. Van Sciver, “Thermal Conductivity of Powder Insulations for Cryogenic Storage Vessels,” Advances in Cryogenic Engineering (Proceedings of the CEC, Keystone, CO, 2005) 52B, 2006, pp. 480-487